Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube

When it comes to electronics packaging, measuring the fracture toughness of adhesive materials is critical. Our research involved conducting double cantilever beam (DCB) tests to study the behavior of sintered silver in mode I fracture, which is doped with different weights of nickel-coated multiwall carbon nanotube additives. The results showed that when the sintered silver DCB adhesive joints contained 0.5 wt% nanofiller, their mode I fracture toughness increased to 0.0701 N/mm. This represents an 89.97 % improvement over the fracture toughness of sintered silver without nanofiller additives. The nickel-coated multiwall carbon nanotube nanofillers influenced both the microstructure characteristics and the propagation path of cracks in sintered silver. We used an inverse method to present cohesive zone models of sintered silver with varying nanofiller contents. The representative mode I resistance curves of sintered silver with different contents of nanofiller are also presented and discussed. The results of our study can help increase the reliability and strengthen the mode I fracture resistance for the sintered silver interconnection bonding layer by adding an appropriate nanofiller.