Evaluation of Thermal Resistance of Direct-Bonded Yb:YAG Ceramic

Yasuhiro Kamba,Chen Qu,Taisuke Miura,Miyuki Uomoto,Takehito Shimatsu

2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR)（2022）

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摘要

We report a measurement of thermal resistance between Yb:YAG and aluminum plate contacted via atomic diffusion bonding (ADB). The thermal resistance of Yb:YAG/Al layer via ADB was 3 times lower than that via indium foil.

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关键词

Thermal Resistance,YAG Ceramics,Aluminum Plate,Pump Power,Deep Ultraviolet,Sum Frequency Generation

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