The Roadmap of 2D Materials and Devices Toward Chips

Highlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the current trends and challenges encountered in the development of 2D materials is summarized. An in-depth roadmap outlining the future development of 2D electronics is presented, and the most accessible and promising avenues for 2D electronics are suggested.