Effect of the substrate treatment on the microstructure of CVD Ti(C,N)/ -Al2O3/TiN hard coatings

Although the use of protective Ti(C,N)/Al2O3 coatings produced by chemical vapour deposition (CVD) on cemented carbide (WC-Co) substrates is the state of the art in high-speed metal cutting, the effect of the substrate treatment on the microstructure of such coatings is not fully understood yet. In this study, the influence of the original substrate grain size (coarse-grained, fine-grained) and the substrate treatment (as-sintered, wet blasted, ground or polished) on the grain size, preferred orientation of crystallites and residual stress in Ti(C,N)/Al2O3 coatings was systematically investigated. The microstructure analyses carried out using scanning electron microscopy with electron backscatter diffraction and symmetrical X-ray diffraction (XRD) revealed that the utilization of fine-grained substrates and the substrate treatment reduce the grain size in both layers, and increase the preferred orientations (211) and (0001) of fcc-Ti(C,N) and alpha-Al2O3 crystallites, respectively. In alpha-Al2O3, the microstructure changes are mainly connected with the morphology of the bonding layer, as it follows the morphology of the fcc-Ti(C,N) facets. The residual stress analyses done using glancing angle X-ray diffraction (GAXRD) disclosed a reduction of the tensile thermal stress in alpha-Al2O3 layers that were deposited on coarsegrained substrates. The residual stress in fcc-Ti(C,N) was substantially less reduced in the whole fcc-Ti(C,N)/ alpha-Al2O3 stacks than in the reference fcc-Ti(C,N) monolayers. Vice versa, fcc-Ti(C,N) in the full stacks contained less crystal structure defects and lower microstrain than in the reference fcc-Ti(C,N) monolayers, because they were exposed to higher temperatures.