Complementary Field-Effect Transistor (CFET) Demonstration at 48nm Gate Pitch for Future Logic Technology Scaling

S. Liao,L. Yang, T.K. Chiu, W.X. You, T.Y. Wu, K.F. Yang, W.Y. Woon, W.D. Ho, Z.C. Lin, H.Y. Hung,J.C. Huang,S.T. Huang, M.C. Tsai,C.L. Yu, S.H. Chen, K.K. Hu, C.C. Shih, Y.T. Chen,C.Y. Liu, H.Y. Lin, C.T. Chung, L. Su,C.Y. Chou, Y.T. Shen,C.M. Chang, Y.T. Lin, M.Y. Lin, W.C. Lin, B.H. Chen, C.S. Hou, F. Lai, X. Chen, J. Wu, C.K. Lin, Y.K. Cheng, H.T. Lin, Y.C. Ku, S.S. Lin, L.C. Lu, S.M. Jang, M. Cao

2023 International Electron Devices Meeting (IEDM)(2023)

引用 0|浏览1
暂无评分
摘要
This study establishes the groundwork for an industry-applicable, integrated nanosheet-based monolithic CFET process architecture with a gate pitch of 48nm. By introducing the middle dielectric isolation, inner spacer, and n/p source-drain isolation, the vertically stacked nFET-on-pFET nanosheet transistors yield a survival rate of over 90% and demonstrate high on-state current with low leakage, achieving a healthy six-order of magnitude on/off current ratio. This work sets the stage for further CFET development and paves the way for a practical process architecture that can fuel future logic technology scaling and PPAC advancement.
更多
查看译文
关键词
Field-effect Transistors,Complementary Transistors,Gate Pitch,Complementary Field-effect Transistor,Current Ratio,Low Leakage,Architectural Practice,Vertical Stacking,Etching,Carrier Mobility,Inverter,Epitaxial Growth,Metal Work Function
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要