Thermal Dissipation in Stacked Devices
2023 International Electron Devices Meeting (IEDM)（2023）
Key words
Thermal Dissipation,Thermal Conductivity,Thermal Resistance,Innovative Materials,Phonon Dispersion,3D Stacks,Aluminum Nitride,Thin Films,Nucleation,Crystallinity,Heat Transfer,Thermal Properties,Grain Size,Hot Spots,Chemical Vapor Deposition,Grain Boundaries,Continuous Wave,Semiconductor Industry,Larger Grain Size,Debye Temperature,Heat Spreader,Polycrystalline Films,Chemical Vapor Deposition Process,Side Of Film,Thermal Path,Microwave Plasma,Single Diamond
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