Design and Modeling of the PCB Rogowski Coil with Multiple Vias for Power Devices

The Printed circuit board (PCB) Rogowski coil, with high bandwidth, small size, and low cost, has already been used for current measurement in power devices. Accurate parameter calculations are crucial for predicting performance and designing the coils. The traditional methods use simple empirical formulas and neglect the parasitic effects of PCB vias, resulting in low model accuracy. In this paper, the parasitic parameters and transfer characteristics of PCB Rogowski coil windings are obtained by modeling the PCB traces and vias. Based on the model, the influence of winding dimensions on the parasitic parameters and the performance of coil are discussed. The accuracy of the method is verified by comparing the results with the vector network analyzer and impedance analyzer measurements.