Solder Die Attach Lifetime Characterization of SOT-227 Power MOSFET Module in a 3-Phase Inverter under Power Cycling
JOURNAL OF MECHANICS（2023）
关键词
metal-oxide-semiconductor field-effect transistor,power MOSFET module,3-phase bridge inverter,power cycling,coupling approach,solder die attach,physical lifetime prediction model,Taguchi experimental design
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