Etch Depth Study for Step-Etched Junction Termination Extensions in Vertical GaN Devices

2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)(2023)

引用 0|浏览2
暂无评分
摘要
This work reports on the optimal dose for a step-etched single-zone junction termination extension by means of a multi-point study on etch depth. Breakdown and device characteristics are reported on over one hundred devices for each dataset to determine a statistically significant representation of the population. Electroluminescence imaging during avalanche breakdown confirms the point at which the JTE switches from full depletion to partial depletion, which corresponds to the maximum breakdown.
更多
查看译文
关键词
Vertical GaN,Edge Termination,Junction Termination Extension,Power Devices,Breakdown
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要