Improvement of Thermal Dissipation of High-Power Photodiodes

Junwu Bai,Yang Shen,Peng Yao,Dekang Chen,Matthew Konkol,Xiangwen Guo,Bingtian Guo,Victoria Carey,Joe C. Campbell,Dennis Prather

2023 IEEE PHOTONICS CONFERENCE, IPC（2023）

引用 0|浏览1

暂无评分

摘要

An n-down MUTC epitaxial structure is designed to improve thermal dissipation. The thermal performance of n-down devices has been simulated. The n-down devices flip-chip bonded to heat sinks are demonstrated to improve thermal characteristics and presage higher RF output power before thermal failure.

查看译文

关键词

uni-traveling carrier photodiodes,InGaAs/InP,thermal dissipation

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要