Microstructure, mechanical properties and arc erosion behavior of CuW composites prepared by high energy ball milling and spark plasma sintering

In this study, the CuW75 composites with excellent interfacial bonding were successfully fabricated by the combination of high energy ball milling and spark plasma sintering (SPS). The microstructure, comprehensive properties, and arc erosion resistance of CuW75 composites were investigated. The results show that with the increase of milling time, a layered structure is gradually formed in the mixed powder of CuW75 composites, and the grain size remains basically unchanged after 40 h. When the ball milling time is 40 h, the CuW75 composites exhibits excellent comprehensive properties, with an electrical conductivity of 24.39% IACS, a hardness of 441 HB, and a relative density of 98.1%. The compressive strength of CuW75 composites after ball milling for 40 h is 49.7% higher than that of commercial CuW75 composites. In terms of arc erosion resistance, the CuW75 composites after ball milling for 40 h have a shallower surface and larger ablation areas. The reason is that good interface bonding and grain refinement improve the strength of the matrix and makes the arc move rapidly along the grain boundaries, retarding downward erosion.