2D and 3D Metrology and Failure Analysis for High Bandwidth Memory Package by Xe and Ar Plasma-FIB

Melissa Mullen, Mark McClendon,Adam Stokes, Xiaoting Gu,Pete Carleson

International Symposium for Testing and Failure Analysis ISTFA 2023 Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis（2023）

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Failure Analysis,Fault Localization

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