Direct Laser Metal Deposition of AISI H13 Cladding on Copper–Beryllium Alloy Substrate Through a Stainless‐Steel Buffer Layer Strategy

In article number 2200387, Zhao Zhao and co-workers demonstrate that the Scheil solidification model can simply estimate solidification cracking susceptibility when cladding dissimilar alloys. Meanwhile, tool steel/Copper-beryllium alloy bimetallic structures could have a bright future in molding industries regarding their excellent performance in load-bearing capability and thermal conductivity simultaneously.