Suppression of Surface Roughening of Ag Films by Capping Layer for Ag/Ag Surface Activated Bonding

Yuanhao Cai,Kai Takeuchi,Miyuki Uomoto,Takehito Shimatsu,Eiji Higurashi

2023 IEEE CPMT Symposium Japan (ICSJ)（2023）

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摘要

A titanium layer (thickness: 2 nm) has been used as a capping layer to suppress the surface roughening of silver (Ag) thin films (thickness: 30 nm) for Ag-Ag surface activated bonding at room temperature.

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关键词

Suppression of surface roughening,capping layer,surface activated bonding

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