Multi Die Stacked Structure Fabricated by WoW Bonding

Haruo Shimamoto,Yuuki Araga,Masahisa Fujino,Naoya Watanabe,Kenji Takahashi,Katsuya Kikuchi,Tsuyoshi Kawagoe, Ichiro Homma,Takatoshi Masuda

2023 IEEE CPMT Symposium Japan (ICSJ)（2023）

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摘要

To achieve 2-die stacking process, fusion bonding technology was applied for Wafer on Wafer (WoW) by each oxide film, and Through Silicon Via (TSV) was used to connect metal layer in each wafer. Electrical characteristics was evaluated to confirm the connection. We also introduced the case study of 4-die stacking using the 2-die stacking technology.

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关键词

Wafer on Wafer,TSV,Fusion Bonding,Wide-I/O DRAM

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