The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy

In recent years, low-melting-point solder is required in electronics packaging. Among them, Sn-Bi alloys are expected to exhibit good wettability. However, they have difficulty in ductility due to the brittle nature of Bi. In some research, to improve the mechanical property of Sn-Bi alloy, Zn and In are added. The modified alloy solder had better mechanical property and the low-melting-point such as Sn-58Bi. However, the strength of the joint part is not enough. Therefore, in this study, the joint properties of Sn-Bi alloys with Zn and In addition were evaluated by varying the Bi content.