Effects of Process to Material Removal in CMP: Modelling and Experiments
2023 China Semiconductor Technology International Conference (CSTIC)（2023）
关键词
chemical mechanical polishing performance,CMP performance,computation modeling,material removal,process experiments,representative process parameters,rotational speed,wafer characterization
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要