Toward hybrid integration of exotic materials in an electronic-photonic CMOS platform via substrate removal
2023 Conference on Lasers and Electro-Optics (CLEO)(2023)
摘要
We demonstrate direct access to the silicon device layer of a monolithic CMOS electronics-photonics platform with a full-digital back-end-metal stack, in post-fabrication at die level, allowing the integration of functional materials (e.g. into slot waveguides).
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