Indirect Testing of Specifications in Analog Integrated Circuits Based on Black-Box Modeling

2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI)(2023)

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摘要
Conventional testing method of post-manufactures analog integrated circuits (ICs) is mainly relied on expensive automatic test equipment (ATE), which measure the specifications that included in the datasheet according to customized testing circuits and stimulus. In this paper, we proposed an indirect testing method based on modeling the mapping relationship between specifications and responses of much simpler circuits as black box. The model with good fitting ability could map the responses to specifications. Taking results obtained by standard approach as references, we verified the accuracy and effectiveness of this kind of indirect method by simulation experiments, the results shows that all errors of selected specifications obtained by standard and indirect method test are maintained in an acceptable level for post-manufacture testing.
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关键词
integrated circuit testing,modeling,black box,indirect test
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