Novel package approach for MEMS pressure sensor

Luca Maggi,Marco Del Sarto,Tiziano Chiarillo,Enri Duqi,Lorenzo Baldo, Adriano Abbisogni, Filippo Daniele

2023 IEEE SENSORS（2023）

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摘要

For the first time the WLCSP approach has been applied to MEMS based pressure sensor. All the wafer level operations have been performed on ASIC wafer, while the MEMS wafer is not modified. The experimental results show good performance of this approach, especially the hysteresis is noticeable small (0.9 hPa).

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关键词

WLCSP,MEMS,Pressure sensor

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