Measurement of the Ultrasound induced Temperature Change in an Ultrasonic Assisted Silver Sintering Process

The process of silver sintering is a key technology in the fabrication of advanced electronic devices. In this study, a multilayer thin film sensor is built and integrated into the joining process of ultrasonic assisted silver sintering to measure the influence of ultrasound on the sintering temperature. The sensor is designed as a resistance thermometer with platinum as the sensing layer. The results show almost a linear relationship between the applied ultrasonic power and the measured temperature increase with a maximum of 4.5 degrees C at a power level of 7000 mW. In addition, higher normal forces result in greater temperature increase.