Investigation of Paralleling Topologies for the New 1500 A 1700 V LinPak Power Module

Hitachi Energy’s new 1500 A 1700 V LinPak power modules featuring state-of-the-art 1700 V fine pattern trench IGBT chipset have been dynamically tested in parallel. Different gate driver topologies, both known as well as novel concepts have been compared to identify benefits and drawbacks of the different approaches. It is shown that simple and cos-teffective solutions can be implemented to achieve excellent static and dynamic current sharing, therefore allowing for parallel operation with lowest derating and highest power densities.