Real-Time Precision Prediction of 3-D Package Thermal Maps via Image-to-Image Translation

Michael Joseph Smith,Seunghyun Hwang, Vinicius Cabral Do Nascimento,Qiang Qiu,Cheng-Kok Koh,Ganesh Subbarayanl,Dan Jiao

2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS(2023)

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摘要
Thermal optimization plays a crucial role in the design of advanced packaging technologies. Due to the large number of thermal simulations needed for optimal design, reductions in simulation run-time are critical. Here, we cast the temperature solution process into an image-to-image translation problem. We model the power generation map, conductivity map, and boundary conditions into separate channels of an image. We then generate temperature solutions by training a conditional image generative model, composed of a U-Net shaped generator and a discriminator, using deep neural networks (NNs). The resultant NN model exhibits superior accuracy for unseen inputs. Speed wise, it enables near real-time design, providing a 1663x and 14,885x speedup over a sparse matrix optimized finite element method (FEM) and ABAQUS((R)) respectively.
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关键词
Image-Based Learning,Heterogeneous Integration,Thermal Integrity
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