A 202 GHz Link Using Planar Transceiver Modules

2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)(2023)

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摘要
We report a 202 GHz wireless data transmission link, communicating 32 Gb/s over 7.1 meters, using planar InP HBT transmitter and receiver modules. The modules are highly integrated and require simple physical assembly without waveguide interfaces. A single 2.8 mm x 0.75 mm InP HBT transmitter IC and a single 2.3 mm x 0.85 mm InP HBT receiver IC, operating from a 24.5 GHz local oscillator (LO) reference, provide frequency conversion between 6 GHz (I, Q) intermediate-frequency (IF) and the 202 GHz modulated carrier. Signals are radiated and received by directly wire-bonding the InP ICs to 2 x 2 patch antenna arrays on 50 mu m SiO2 substrates, with these antennas coupled to external 50 mm diameter PTFE lenses. 8 Gbaud 16QAM data transmission (32 Gb/s) over 7.1 m, on a link with 10.4 dB added attenuation, showed 13.4% RMS error vector magnitude.
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关键词
mm-wave wireless,6G wireless,mm-wave ICs,THz wireless,mm-wave MIMO
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