Exploring Capabilities of Maskless Lithography for Dual- Image Exposure in FO WLP

Ksenija Varga,Thomas Uhrmann,Roman Holly,Tobias Zenger, Chris Milasinic,Mel Zussman, Ron Legario, Michae L. Knaus

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）

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摘要

EVG's maskless exposure lithograph y enab les 3D du al- image patt erning of novel dielect rics replacing th e cost consuming dua l- damascene process in WLP. The pa ttern sizes < 4 um ( bottom via) with layer thickness 8 um were accomplished in this investigat ion. Uniq ue features of LITHOSCALE (R) sup port va riety of R& D designs, technology tran sfer to HVM and fast time- to- market of new designs in the grow ing semicond uctor world.

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关键词

maskless exposure technology,LITHOSCALE®,digital lithography,advanced packaging,dielectric layers,dual-exposure,positive tone PBO

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