Module, Antenna, and Package Design Considerations for Mm-Scale IoT Devices
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）
关键词
IoT,silicon interposer,organic package,antenna,mm-scale,mm-wave,28 GHz,5.8 GHz,900 MHz,electrically small,dipole,antenna-in-package
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