A Technical Review on State of the Art In-Plane and Out-of-Plane Deformation Measurement Techniques for Microelectronic Packages

As the industry moves towards miniaturization of electronics, the need for higher accuracy in in-plane and out-of-plane deformation measurement techniques keeps increasing. Due to a multitude of reasons such as sample size, temperature cycling requirement, location of the surface to be measured etc., conventional contact-based techniques are not implemented, and instead non-contact techniques are adapted. There are different non-contact methodologies being used currently by researchers and industries for accurate measurement requirements depending on the nature of the sample (dimensions, location of interest, surrounding conditions like temperature cycling etc.). The goal of this paper is to consolidate different methods used currently in the industry and offer a go-to guide while choosing the appropriate methodology based on the requirements.