Thermal performance enhancement of a micro-jet heat sink via parametric investigated micro pin fin arrays

The thermal management issue of high electronic chips with heat flux is one of the most challenge during the development of electronic devices. In this work, the design of micro pin fin arrays (MPFA) of micro-jet heat sink was proposed to achieve effective cooling of electronic chips. The MPFA with different cross-sectional shapes were used to improve the thermal performance of the heat sink. The results show that heat sink design with MPFA exhibit excellent cooling performance while consuming approximately the same amount of power as smooth surface. In addition, the hexagonal cross-section has better thermal performance, the temperature uniformity of the heating surface can be improved by up to 70 % and the average temperature can be reduced by 7-20K. Moreover, the manufacturing cost and cooling performance per unit cost were investigated and the results show that the square cross-section is the most commercially viable. Based on this, the square cross-section was parametrically studied, including the length to height ratio and fins number. It was founded that the heat sink exhibits better thermal performance for a length-to-height ratio of 1.4 and a number of fins of 169. Finally, the ultimate heat flux of the electronic chip can be withstood was also tested, and the optimal heat sink design can handle heat flux of 400W/cm2. Therefore, the heat sink with MPFA design can significantly improve the thermal performance without consuming the pump power, which can be used to cooling the high electronic chips with high heat flux in the future.