Thermal simulation analysis of radar T/R components based on fluid heat dissipation

T/R components are important components in radar, and the analysis of the temperature field of T/R components is a key problem in radar. In order to study the thermal effect of T/R components, ANSYS Workbench finite element thermal analysis is introduced to analyze and design the heat transfer. Firstly, the actual operating temperature is read for testing and a three-dimensional model of the T/R component is established. In addition to considering the thermal effect of the chip and the three-dimensional structure of the component, the model also considers the material properties of different locations of the component. Secondly, the temperature field distribution of the T/R component is obtained by simulation analysis, and finally the simulation results are compared with the actual measurement results, and it is found that the error between the simulation results and the measurement results is less than 10%, which provides a basis for the reliability of the component thermal design.