Structural investigation of nanovoids around the interface of micro-vias by spherical aberration corrected scanning transmission electron microscopy

M. C. Hsieh, M. Nishijima, K. Jogo,Z. Zhang, R. Okumuara,H. Yoshida, C. Chen,A. Suetake, H. Honma, H. Seto, Y. Kitahara, K. Kita,K. Suganuma

MICROELECTRONICS RELIABILITY(2023)

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摘要
In this study, we investigated the microstructural characteristics of nanovoids that form during the electroless Cu plating process for micro-vias using a spherical aberration-corrected scanning transmission electron microscope. The nanovoids, which form during the early stages of the plating process, have a spherical shape with an outermost layer covered with Pd. They are not only empty spaces but partly filled with complexing agent elements, reaction production gas, and other materials.
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关键词
nanovoids,transmission electron microscopy,electron microscopy,micro-vias
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