Silicon Lifecycle Management: Trends, Challenges and Solutions : Tutorial 2

2023 IEEE International Test Conference in Asia (ITC-Asia)(2023)

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摘要
Recent advances in automotive SOCs, artificial intelligence accelerators, and high-performance computing engines in data centers have led to an explosion in the adoption of emerging technology nodes and 3DIC/chiplet packages. This tutorial will present today’s trends and discuss on the resiliency challenges for such emerging SOCs. It will then focus on optimizing the SOC health using advanced solutions typically utilized for managing the different silicon lifecycle stages: from silicon debug in early bring up stage to shorten the time-to-volume; to self-test and repair during volume production stage, in order to improve quality and yield; to power-on self-test in the field stage to address aging challenges; to periodic checking in-system to improve functional safety; and finally to fault tolerance and error correction during mission mode to address a range of transient errors. All of the above optimizations are materialized by on-chip and/or off-chip data analytics.
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