Ultra High-Density SOT-MRAM Design for Last-Level On-Chip Cache Application

This paper presents ultra high-density spin-orbit torque magnetic random-access memory (SOT-MRAM) for last-level data cache application. Although SOT-MRAM has many appealing attributes of low write energy, nonvolatility, and high reliability, it poses challenges to ultra-high-density memory implementation. Due to using two access transistors per cell, the vertical dimension of SOT-MRAM is >40% longer than that of the spin-transfer torque magnetic random-access memory (STT-MRAM), a single transistor-based design. Moreover, the horizontal dimension cannot be reduced below two metal pitches due to the two vertical metal stacks per cell. This paper proposes an ultra-high-density SOT-MRAM design by reducing the vertical and horizontal dimensions. The proposed SOT-MRAM is designed by a single transistor with a Schottky diode to achieve lesser vertical dimension than the two-transistor-based design of conventional SOT-MRAM. Moreover, the horizontal dimension is also reduced by sharing a vertical metal between two consecutive bit-cells in the same row. The comparison of the proposed designs with the conventional SOT-MRAM reveals a 63% area reduction. Compared with STT-MRAM, the proposed high-density memory design achieves 48% higher integration density, 68% lower write power, 29% lower read power, and 1.9x higher read-disturb margin.