High-temperature Adaptive Through-Silicon Via with Pyrolyzed Carbon Via-Sealing Plates for Packaging 3D Carbon Nanostructure-Based Devices Fabricated Using C-MEMS
CARBON（2024）
关键词
Through-silicon via,Carbon via-sealing plates,High-temperature compatibility,C-MEMS,Pyrolyzed carbon,Wafer-level packaging
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要