ESD mitigation for 3D IC hybrid bonding

Shih-Hsiang Lin,Marko Simicic,Nicolas Pantano,Shih-Hung Chen,Philippe Roussel,Geert Van der Plas,Eric Beyne,Piet Wambacq

2023 45TH ANNUAL EOS/ESD SYMPOSIUM, EOS/ESD（2023）

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摘要

Three-dimensional (3D) die-stacking has become a promising way to continue improving the integrated circuits performance. However, the risk of electrostatic discharge (ESD) during the stacking process is not yet fully understood. In this paper, we focus on understanding the electrostatics before the contact moment for the 3D stacking process. Our findings indicate that the stacking process presents a relatively low risk of ESD.

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