Effect of key structure and working condition parameters on a compact flat-evaporator loop heat pipe for chip cooling of data centers

Loop heat pipe has the advantages of large heat transfer coefficient without extra power input, therefore it has a good application potential in chip cooling of data centers. In this paper, a compact flat-evaporator loop heat pipe is designed and the effects of key structural parameters and working conditions on the dynamic and steady-state performance are studied. The results show that increasing heat load or the filling ratio, arranging vapor channels in the middle of the wick (rather than at the bottom) or lengthening the condenser can all reduce the temperature fluctuation; A small inclination angle of 5 & DEG; and 10 & DEG; can reduce the temperature fluctuation and the stable temperature, while large inclination angle of 15 & DEG; will instead bring higher stable temperature; When the heat load increases step by step, the stable temperature (average temperature for fluctuation conditions) decreases and then increases for all filling ratios and structures; Minimized thermal resistance is achieved by optimizing wick and condenser structure under low and high heat load, respectively.