Laser debonding application in ultra-thin device processing.
Applied optics(2023)
摘要
Laser debonding offers several advantages such as precision, speed, minimal damage, and being noncontact. We investigated the feasibility of utilizing laser processing technology in producing high-performance ultra-thin wafer devices at a low cost. We successfully utilized the 355 nm ultraviolet nanosecond laser to develop a compatible laser debonding process for domestic temporary bonding adhesives, which effectively performed the laser lift-off of 8-in (20.3 cm) silicon/temporary bonding adhesive/glass substrate samples at a power density of 250 / . We designed and developed a line light source shaping system that was ultimately able to produce a line spot with a length exceeding 1 cm and an energy distribution unevenness of less than 10%.
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关键词
laser debonding,ultra-thin
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