Enhancing Thermal Conductivity and Mechanical Strength of TPU Composites Through Modulating o-PDA-BN/rGO Heterointerface Networks

•Proposed hybrid filler strategy enhances thermal conductivity, electrical insulation, and mechanical properties of TPU composites.•BN and rGO fillers are modified using ortho-phenylenediamine and covalently linked through solvothermal reaction.•The o-PDA-BN/rGO composite exhibits improvements in thermal conductivity, volume resistivity, tensile strength, and Young's modulus.•Successful surface modification and covalent interactions offer a promising solution for next-gen electronic devices.