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Improving Uniformity of 3-Level High Aspect Ratio Supervias

D. Montero,P. Marien,Y. Hermans,V. Vega-Gonzalez,Y. Feurprier,N. Oikawa,N. Buccheri,C. Wu,G. T. Martinez,D. Batuk,H. Puliyalil,S. Decoster,K. Kumar,F. Lazzarino,G. Murdoch,S. Park,Z. Tokei

2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM（2023）

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Key words
High-aspect ratio via,Supervia,BEOL,Ru,scaling booster
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