Sensors at the Edge: Towards Micromechanical in-Memory Computing.

COINS(2023)

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摘要
In this paper, we present a series of mechanical components that can be interconnected to form mechanical integrated sensor circuit. Functions within the measurement chain that are typically implemented by electronic components, can be realized here by mechanical components. We demonstrate how these components enable initial data preprocessing at the sensor level, such as applying defined transfer functions on a measurement signal. The proposed mechanical sensors operate in the analog domain and store only pre-defined values of interest instead of generating measurement results at a given sampling rate. Our approach offers a novel alternative to electronic circuits for implementing sensors and measurement chains aiming on a reduction of data generation and energy consumption within condition monitoring applications
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关键词
in-memory computing,MEMS,micromechanical,edge computing,silicon,sensor,condition monitoring
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