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Catching the Missing EM Consequence in Soft Breakdown Reliability in Advanced FinFETs: Impacts of Self-heating, On-State TDDB, and Layout Dependence.

2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)(2023)

Cited 2|Views49
Key words
TEM,self-heating,EM,CMOS,MOL
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