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A 320 X 320 1/5" BSI-CMOS Stacked Event Sensor for Low-Power Vision Applications.

Guillaume Schon, Denis Bourke, Pierre-Antoine Doisneau,Thomas Finateu, Adrien Gonzalez, Naoyuki Hanajima, Tahar Hitana, Lucas Janse Van Vuuren,Moataz Kadry, Charles Laurent,Florian Le Goff,Daniel Matolin, Adel Mezaour, Benoît Michel, Thulaxan Naguleswaran, Tjaart Opperman, Patrice Perrin,Etienne Reynaud, Farzaneh Shahrokhi, Hiba Tahachouite, Chen Tianfan,Gerd Van den Branden, Akli Ziram, Jean-Luc Jaffard,Christoph Posch

2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)(2023)

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关键词
Event-based vision,event sensor,3D stacking,CIS
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