A method to evaluate the thermal resistance of a laser by wavelength hysteresis

Packaging is one of the key technologies of optoelectronic devices. It also determines the performance of the packaged device. In the article,a method based on wavelength hysteresis is proposed to evaluate the ther. mal resistance of the laser at ambient temperatures from 298 K to 10 K. The thermal resistance is characterized by calculating the value of wavelength hysteresis during the cooling and heating process. This method solves the problem that the heat dissipation performance of the laser cannot be evaluated at low temperatures. This is of great significance to the optical interconnection at low temperatures. It also provides a reference for the package design of lasers in a low-temperature environment.