Enhanced interface heat transfer based on gallium-based liquid metal infiltrated into vertically aligned copper nanowire arrays

•The thermal interface material (TIM) prepared by liquid metal/nanowire arrays enhances heat transfer.•The contact angle between liquid metal and nanowire arrays decreased by 142.5°.•The total thermal contact resistance of the TIM is as low as 3.20 ± 0.24 mm2K/W.•The total thermal contact resistance is proportional to roughness and inversely proportional to pressure.•The total thermal contact resistance increases by 0.57 mm2K/W after ageing tests.