Microstrip Reliability Assessment under High Temperature in 5G Application

L. Shi, W. Zeng, Z. Wang,A. Cui,C. Wang

12th International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2022)（2022）

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Key words

accelerated aging theory,ageing test,different line width,high output power,high temperature reliability,microstrip reliability assessment,mission profile experiment,power amplifiers,refinement temperature distribution,reliability related parameter,temperature 145.0 degC,time 10.0 year

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