$D$

D-Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBs

Siddhartha Sinha, Heinrich Trischler,Ilja Ocket, Erich Schaffler

IEEE Microwave and Wireless Technology Letters(2023)

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摘要
We report $D$ -band air-filled substrate integrated waveguides (AFSIWs) with solid copper sidewalls fabricated inside a multi-layer printed circuit board (PCB) with broad wall width of 1.6 mm and cavity height of $300~\mu \text{m}$ . Measurements show a loss of 0.07–0.08 dB/mm across 115–155 GHz. This result is the first demonstration of an AFSIW above 100 GHz in a low-cost mass manufacturable PCB and has the lowest loss compared to reported planar PCB lines or substrate integrated waveguides (SIWs) in PCBs and Interposers. We also introduce a broadband stripline to the AFSIW launcher using a broad wall transverse slot which offers ease of manufacturability over existing transitions having a measured insertion loss of 1.1 dB and 27% bandwidth. The combination of a low-loss AFSIW and wideband launcher allows both striplines and AFSIWs to coexist in the same multi-layer PCB.
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关键词
substrate integrated waveguide,afsiw launcher,broadband stripline,air-filled,multi-layer
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