Joining of p-type skutterudite and Cu electrodes with a laser patterned interfacial structure

•A novel laser patterned CoMo diffusion barrier layer was first time used to join the p-type skutterudite and Cu electrodes.•The optimal spacing for the laser patterned CoMo diffusion barrier layer was 200 μm.•The shear strength of the brazed joint increased by 1.5 times after laser patterned treatments.•Fracture transformed from inside the reaction layer to the skutterudite substrates after laser processing.