Adhesion, microstructure and electrical resistance of sputtered Cu films on alumina substratesIgor Olegovich Usov, David M. Waschezyn,Douglas R. Vodnik, Robert Ryan Waked, Michael Robert Middlemas,Matthew M. Schneider,Terry George Holesingercrossref(2019)引用 0|浏览0暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要