Comprehensive Performance of Polyimide Reinforced by Multiple Hydrogen Bonds for Flexible Electronics Application
ACS APPLIED POLYMER MATERIALS（2023）
关键词
pyrimidinone,multiple hydrogenbonding,lowcoefficient of thermal expansion,polyimide film,flexible electronics,flexible printed circuit,adhesion
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要