High performance vapor chamber enabled by leaf-vein-inspired wick structure for high-power electronics cooling

Applied Thermal Engineering（2023）

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摘要

•A novel vapor chamber was developed for high-power electronics cooling.•Leaf-vein-inspired wick structure was implemented.•Cooling conditions impact the vapor chamber thermal resistance slightly.•A vapor chamber with 500 W heat dissipation capability was achieved.

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关键词

Vapor chamber,Leaf-vein-inspired wick,Heat transfer performance,Thermal resistance,Heat dissipation

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