Modified-LCP-Based Housing for Hermetic Package of Microwave Devices

A thermoplastic modified Liquid Crystal Polymer (LCP) based leadframe for the packaging of microwave power devices is presented in this work. Three parts will be detailed in the proposed paper: the modified LCP material customized and developed by Speed company, Air Cavity Package (ACP), and modified LCP based ACP. The modified LCP material has the characteristics of delayed crystallization, low shrinkage and high dimensional stability, stable mechanical properties, and low dielectric properties. It is suitable for micron/nano metal filling combinations to achieve high binding force and high sealing application scenarios.The air cavity package provides excellent environmental protection for microwave power devices. The presented LCP based ACP leadframe has advantages of low cost, lightweight, and robust. In the meanwhile, this paper adopted Nano Molding Technology (NMT) to make metal and LCP material have better adhesion.